[J1] T. Tilford, K. I. Sinclair, C. Bailey, M. P. Y. Desmulliez, G. Gousettis, A. K. Parrott and A. J. Sangster, “Multiphysics Simulation of Microwave Curing in Micro-Electronics Packaging Applications,” Journal of Soldering and Surface Mount Technology, vol. 19, no. 3, pp. 26-33, 2007. Link

[J2] A. J. Sangster and K. I. Sinclair, “Multi-mode degenerate mode cavity for hyperthermia treatment,” IEE Proc. Microwaves, Antennas & Propagation, vol. 153, no. 1, pp.75-82, 2006. Link

[J3] A. J. Sangster, K. I. Sinclair, M. P. Y. Desmulliez and G. Gousettis, “Open-Ended Microwave Oven for Flip-Chip Assembly,” IET Microw. Ant. & Propag., vol. 2, no. 1, pp. 53–58, February 2008. Link

[J4] K. I. Sinclair, G. Gousettis, M. P. Y. Desmulliez, A. J. Sangster, T. Tilford, C. Bailey and A. K. Parrott, “Optimisation of an Open-Ended Microwave Oven for Microelectronics Packaging,” IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 11, pp. 2635-2641, 2008 Link

[J5] T. Tilford, M. Ferenets, J. E. Morris, A. Krumme, S. Pavuluri, P. R. Rajaguru, M. P. Y. Desmulliez and C. Bailey, "Application of Particle Swarm Optimisation to Evaluation of Polymer Cure Kinetics Models", Journal of Algorithms & Computational Technology Vol. 4 No. 1, 2009 Link

[W1] Ilaria Bonetti “la ricerca per una nuova tecnologia di saldatura a microonde,” Roma Tech & South Europe Forum 2nd and 3rd of December 2009. FAMOBS general presentazione

[W2] Prof. Marc Desmulliez, Dr. George Goussetis, Sumanth Kumar Pavuluri “Microwave curing in comparison to conventional curing,” Roma Tech & South Europe Forum 2nd and 3rd of December 2009. FAMOBS technical presentation

[W3] Prof. Chris Bailey, Tim Tilford "Simulation of the microwave curing process in Famobs" Roma Tech & South Europe Forum 2nd and 3rd of December 2009. Simulation process of microwave curing

[P1] A.J. Sangster, K.I. Sinclair, M.P.Y. Desmulliez, “Frequency Agile Microwave Oven Bonding System,” UK Patent No. GB0711986, 2007.

[P2] K.I. Sinclair, A.J. Sangster, M.P.Y. Desmulliez, and G. Goussetis, "Frequency agile microwave oven bonding system," UK Patent No. GB0819335.1, 2008.